4月15日,自研市场有消息传出,应成小米日前内部宣布,立芯大刀记在手机部产品部组织架构下成立芯片平台部,片平任命秦牧云担任芯片平台部负责人,台部向产品部总经理李俊汇报。自研
资料显示,应成秦牧云此前曾在高通任职,立芯担任高通产品市场高级总监,片平大刀记后加入小米。台部
但在当天傍晚,自研小米集团公关部总经理王化发文回应关于成立芯片平台部相关消息,应成表示小米集团的立芯手机产品部的芯片平台部一直存在,主要负责收集产品芯片平台选型评估和深度定制,片平而秦牧云也加入小米已久。台部
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